Document Title / Description
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Doc. #
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Date
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CMOS Display Driver Products Datasheet Change
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v.1.0
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12/7/2007
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Holt Integrated Circuits is making a change in Datasheet IDD parameter to account for typical manufacturing variability in it's CMOS High Voltage LCD Display Driver Products.
Download PCN0703
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ARINC 429 Line Driver Die Change for HI-8585 & HI-8586 Products
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v.1.0
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12/3/2007
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The purpose of this notification is to document die change to the HI-8585 and HI-8586 ARINC 429 Line Driver products.
Download PCN0704
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44-Pin Plastic QFP Assembly Location Change
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v.1.0
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3/6/2008
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The purpose of this notice is to describe the changes to the 44-pin plastic QFP packages for the HI-8448PQxx-xx family of ARINC 429 line receiver products.
Download PCN0707
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HI-6110 Die Revision and Data Sheet Change
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v.1.0
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5/14/2008
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.
Download PCN0801
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Marking and Data Sheet Change for HI-3585 Series of ARINC 429 SPI Interface Products
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v.1.0
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5/14/2008
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The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side marking convention for the 3585 series of ARINC 429 SPI interface products and released the final production version of their respective data sheets.
Download PCN0802
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44L TQFP (PTQS) Package Lead Formation
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v.1.0
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5/28/2008
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The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation.
Download PCN0803
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44L PLCC Package and DAP Size Standardization
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v.1.0
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6/30/2008
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The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.
Download PCN0804
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52-Lead Quad Flat Pack (QFP) Package Transfer
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v.1.0
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9/12/2008
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The purpose of this notice is to describe the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
Download PCN0805
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Assembly Location and Mold Compound Change for QFN Packages
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v.1.0
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9/12/2008
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The purpose of this notice is to describe the changes to the QFN packages for the ARINC 429 and MIL-STD 1553 family of devices.
Download PCN0806
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HI-6110 Die Revision and Data Sheet Change
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v.1.0
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12/12/2008
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.
Download PCN0807
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3182PSx-N ARINC 429 Differential Line Driver Change for
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v.1.0
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11/12/2008
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The purpose of this notice is to describe the changes to the ARINC 429 Differential Line Driver Die Change for the 3182PSx-N.
Download PCN0808
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32 & 64-Lead Quad Flat Pack (QFP) Package Transfer
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v.1.0
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9/12/2008
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The purpose of this notice is to describe the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.
Download PCN0809
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Addition of Criteria Labs in Austin, Texas as a qualified ceramic package assembly supplier.
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v.1.0
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12/2/2008
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The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.
Download PCN0810
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Wafer Fab Process Transfer for HI-8382/8383 & HI-8588/8588-10 Series of ARINC 429 Products
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v.1.0
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12/2/2008
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The purpose of this notice is to announce the completed transfer of the Holt devices manufactured using the 100mm 4.0um CMOS Wafer Process at Dalsa Semiconductor in Quebec, Canada to Dalsa’s 150mm 4.0um CMOS Wafer Process within the same fab.
Download PCN0811
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Die Change for HI-3186PSx ARINC 429 Differential Line Driver
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v.1.0
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12/2/2008
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This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3186PSx.
Download PCN0812
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Die Change for HI-3182PJx & HI-3183PJx ARINC 429 Differential Line Drivers
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v.1.0
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7/28/2009
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This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PJx and HI-3183PJx.
Download PCN0901
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Die Change for HI-3188PSx ARINC 429 Differential Line Driver
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v.1.0
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7/28/2009
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This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3188PSx.
Download PCN0902
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Die Change for HI-3182PSx & HI-3183PSx ARINC 429 Differential Line Drivers
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v.1.0
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7/28/2009
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This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PSx & HI-3183PSx.
Download PCN0903
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HI-3585 & HI-3588 Data Sheet Change
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v.1.0
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5/7/2010
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3585 & HI-3588 Product which will result in the elimination of Product Advisory PA-100.
Download PCN1001
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HI-3185PSx & HI-3185PSx-N ARINC 429 Line Driver Die Change
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v.1.0
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4/22/2010
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This notice describes the changes to the ARINC 429 Differential Line Driver Die for the HI-3185PSx & HI-3185PSx-N.
Download PCN1002
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100-Lead Quad Flat Pack (QFP) Package Transfer
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v.1.0
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4/22/2010
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100-Lead Quad Flat Pack (QFP) Package Transfer
Download PCN1003
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HI-3582A, HI-3583A & HI-3584A Data Sheet Change
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v.2.0
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7/19/2010
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3582A, HI-3583A, & HI-3584A Product.
Download PCN1004
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MIL-STD-1553 Bus Transceivers Plastic SOIC Package Change
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v.1.0
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6/22/2010
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The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the lead standoff for the 20 Pin Plastic Small Outline ESOIC-WB packages assembled at CEI, Thailand.
Download PCN1005
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52 & 44 Lead Quad Flat Pack (QFP) MSL Improvement
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v.1.0
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10/1/2010
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The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the 52 & 44 Lead Quad Flat Pack (QFP) packages to improve the moisture sensitivity level (MSL) for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
Download PCN1006
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28 Plastic Leaded Chip Carrier (PLCC) Lead Frame, Mold Compound & Die Attach Change
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v.1.0
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10/1/2010
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The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the 28 J-Lead PLCC Package for the ARINC 429 family of devices.
Download PCN1007
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Addition of Greatek Electronic, Taiwan for QFN, TQFP, TSSOP & SOIC Package Assembly
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v.1.0
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12/1/2011
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The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP, TSSOP and Small Outline (SOIC) packages for Holt’s ARINC 429, ARINC 825, MIL-STD 1553, Discrete to Digital, & LCD Display Driver family of devices.
Download PCN1101
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44-Lead Quad Flat Pack (QFP) Footprint & Package Change
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v.1.0
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12/1/2011
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This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.
Download PCN1102
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52-Lead Quad Flat Pack (QFP) Package Change & Transfer
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v.2.0
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2/27/2013
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This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
Download PCN1103
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MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer
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v.1.0
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1/20/2012
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The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.
Download PCN1201
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Addition of SPEL Semiconductor, India for QFN, TSSOP & SOIC Package Assembly
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v.2.0
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11/27/2013
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The purpose of this notification is to announce the addition of SPEL Semiconductor, India assembly facility for QFN, TSSOP and Small Outline (SOIC) packages for Holt’s ARINC 429, ARINC 825, MIL-STD 1553, and Discrete to Digital family of devices.
Download PCN1202
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Addition of Millennium Microtech, Thailand for PLCC & SOIC Package Assembly
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v.1.0
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1/20/2012
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The purpose of this notification is to announce the addition of Millennium Microtech, Thailand assembly facility for Plastic Leaded Chip Carrier (PLCC) and Small Outline (SOIC) packages for Holt’s ARINC 429 and discrete to digital family of devices.
Download PCN1203
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HI-3585 & HI-3588 Data Sheet Change
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v.1.0
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8/24/2012
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3585 & HI-3588 Product with regards to SPI Interface Timing at 5.0V and 3.3V.
Download PCN1204
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100mm to 150mm Wafer Conversion for HI-8482 Series of ARINC 429 Products
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v.1.0
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9/21/2012
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The purpose of this notice is to document the completed conversion of Holt devices manufactured using the 100mm 4.0um CMOS Wafers at Dalsa Semiconductor in Quebec, Canada to Dalsa’s 150mm 4.0um CMOS Wafers within the same fab.
Download PCN0904
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Assembly Location Addition for Ceramic Side-Brazed DIP Package
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v.1.0
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11/19/2012
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The purpose of this notice is to describe an addition to the location of assembly of ceramic packages for the ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.
Download PCN1206
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HI-8588PSxx-10 Die Revision
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v.1.0
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8/1/2014
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-8588PSxx-10 Product.
Download PCN1401
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HI-3585 and HI-3587 Die Revision
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v.1.0
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1/15/2015
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-3585 and HI-3587 Family of Products. The design change improves the robustness of the HI-3585 and HI-3587 ARINC line driver outputs while dynamically transmitting and subjected to transient voltages.
Download PCN1402
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HI-3585, HI-3586, HI-3587 Die Revision
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v.2.0
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10/10/2016
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-3585, HI-3586, and HI-3587 Family of Products. This minor design change corrects a potential problem with the HI-3585/6/7, which can transmit an unintended ARINC Label 0x00 message (with all zeros) under certain SPI timing conditions. Information on how this condition occurs and workarounds are provided in Holt’s product advisory PA-102 revision New.
Download PCN1601
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Addition of NiPdAu Leadframe Finish for QFN Assembly
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v.1.0
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6/15/2018
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The purpose of this notification is to announce the addition of NidPdAu Leadframe Finish from Greatek Electronics, Taiwan assembly facility for QFN packages for Holt’s ARINC 429 & MIL-STD-1553 family of devices.
Download PCN1801
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Die Revision Change to the HI-1590 Family of Products.
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v.1.0
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5/7/2019
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Holt Integrated Circuits is implementing a minor design change to decrease tail-off for digital control and improve the yield for sinusoid no-response at 500mV over temperature. This improvement will result in a die revision change for the HI-1590 die from Revision C to Revision D. There is no change to Fit, Form, Function, Quality or Reliability of these devices. The products will be fully compliant to all published specifications of HI-1590 datasheet.
Download PCN1901
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HI-1584 & HI-1585 Family of Products Die Revision & Datasheet Change
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v.1.0
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1/23/2020
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Holt Integrated Circuits is implementing a design change to improve noise immunity for the Power On Reset circuitry, and improve the ESD performance for the RX inputs. This improvement will result in a die revision change for the HI-1585 die from Revision D to Revision F and datasheet DS1584 Revision D to Revision E and DS1585 Revision E to Revision F. The products will be fully compliant to all published specifications of HI-1584 and HI-1585 datasheet.
Download PCN1902
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HI-1584 & HI-1585 Family of Products Die Revision
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v.1.0
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1/23/2020
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Holt Integrated Circuits is implementing a minor design change to improve the yield for Tail-Off Compensation over temperature. This improvement will result in a die revision change for the HI-1584 die from Revision F to Revision G. There is no change to Fit, Form, Function, Quality or Reliability of these devices. The products will be fully compliant to all published specifications of HI-1584 and HI-1585 datasheet.
Download PCN1903
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Conversion to NiPdAu Leadframe Finish for QFN Assembly
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v.1.0
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8/21/2020
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The purpose of this notification is to announce the conversion of external leadframe plating finish on certain ARINC, Discrete to Digital & MIL-STD-1553 family of devices from 100% Matte Tin and SnPb plating to Nickel Palladium Gold (NiPdAu) lead finish. In addition, the die attach and mold compound material has changed.
Download PCN2001
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HI-3210PQTF Die Revision Change
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v.1.0
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1/8/2021
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The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision to the HI-3210PQTF Product. This is a minor design change to improve device performance by preventing a duplicate FIFO read under specific timing conditions.
Download PCN2101
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HI-6300 DO-254 Artifact Revision Changes
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v.1.0
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9/9/2021
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The purpose of this notification is to announce that Holt Integrated Circuits has updated the Verilog Test Bench and has consequently made a change to the DO-254 Artifacts which are provided with the HI-6300 Product. There was no change to the IP Core.
Download PCN2102
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HI-8429 Die Revision Change
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v.1.0
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3/30/2022
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The purpose of this notification is to announce that Holt Integrated Circuits has made a die revision change to the HI-8429 Family of Product and that Product Advisory PA-106 no longer applies.
Download PCN2201
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HI-2130GBxF Solder Ball Size Change
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v.1.0
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12/10/2022
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The purpose of this notification is to announce that Holt Integrated Circuits has made a solder ball size change to the HI-2130GBxF Family of Product.
Download PCN2202
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