HI-1573 / HI-1574

Holt Integrated Circuits continues its support of the MIL-STD-1553 data bus with a true single chip, dual 3.3V transceiver. Using proven design techniques and state-of-the-art analog CMOS technology, the new HI-1573 dissipates only 500mW when transmitting at 100% duty cycle while still delivering the required power to the bus.

Each set of receiver outputs can also be independently forced to the bus idle state (logic '0' on HI-1573 or logic '1' on HI-1574) by setting RXENA or RXENB low.

The part is available in a small, 20-pin SOIC package with an integrated metal heat sink in the base of the device that ensures adequate heat dissipation in even the most demanding environments. Measuring only 0.5 x 0.4 inches, and only 0.1 inch thick, the HI-1573 offers the smallest board footprint available for this function, and is small enough even for PCMCIA applications.

The devices may be used with standard MIL-STD-1553 transformers with a 1:2.5 turns ratio for direct coupled and 1:1.79/1:1.4 turns ratios for transformer coupled bus connections.

Samples of the HI-1573 and HI-1574 are readily available in the small thermally enhanced plastic SOIC as well as in the traditional 20-pin ceramic DIP package.

Features

  • Compliant to MIL-STD-1553A & B, and ARINC 708A
  • 3.3V Single Supply Operation
  • CMOS Technology for Low Standby Power
  • Smallest Footprint Available in 20-Pin Plastic ESOIC (Thermally Enhanced) Package
  • Less Than 0.5W Power Dissipation
  • Available in DIP and Small Outline ESOIC Package Options
  • Industrial & Extended Temperature Ranges Available
  • Industry Standard Pin Configurations

Applications

  • MIL-STD-1553 Interfaces
  • Smart Munitions
  • Stores Management
  • Sensor Interfaces
  • Instrumentation
  • Test Equipment
Part #Package DescriptionTemp RangeFlowMoisture Sensitivity LevelRoHS Compliant
HI-1573PCM44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CM3N/A
HI-1573PCMF44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CM3Yes
HI-1574PCMF44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CM3Yes
HI-1574PCM44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CM3N/A
HI-1574PSMF20 Pin Plastic ESOIC - WB-55°C to +125°CM1Yes
HI-1573PSMF20 Pin Plastic ESOIC - WB-55°C to +125°CM1Yes
HI-1573PSI20 Pin Plastic ESOIC - WB-40°C to +85°CI1No
HI-1574PSI20 Pin Plastic ESOIC - WB-40°C to +85°CI1No
HI-1574PST20 Pin Plastic ESOIC - WB-55°C to +125°CT1No
HI-1573PST20 Pin Plastic ESOIC - WB-55°C to +125°CT1No
HI-1573PSM20 Pin Plastic ESOIC - WB-55°C to +125°CM1No
HI-1574CDM20 Pin Ceramic Side-Brazed DIP-55°C to +125°CMN/ANo
HI-1573CDM20 Pin Ceramic Side-Brazed DIP-55°C to +125°CMN/ANo
HI-1573CDT20 Pin Ceramic Side-Brazed DIP-55°C to +125°CTN/AYes
HI-1574CDT20 Pin Ceramic Side-Brazed DIP-55°C to +125°CTN/AYes
HI-1574CDI20 Pin Ceramic Side-Brazed DIP-40°C to +85°CIN/AYes
HI-1573CDI20 Pin Ceramic Side-Brazed DIP-40°C to +85°CIN/AYes
HI-1573PCI44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-40°C to +85°CI3N/A
HI-1574PCI44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-40°C to +85°CI3N/A
HI-1574PCT44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CT3N/A
HI-1573PCT44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CT3N/A
HI-1574PSM20 Pin Plastic ESOIC - WB-55°C to +125°CM1No
HI-1573PSIF20 Pin Plastic ESOIC - WB-40°C to +85°CI1Yes
HI-1574PSIF20 Pin Plastic ESOIC - WB-40°C to +85°CI1Yes
HI-1574PSTF20 Pin Plastic ESOIC - WB-55°C to +125°CT1Yes
HI-1573PSTF20 Pin Plastic ESOIC - WB-55°C to +125°CT1Yes
HI-1573PCIF44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-40°C to +85°CI3Yes
HI-1574PCIF44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-40°C to +85°CI3Yes
HI-1574PCTF44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CT3Yes
HI-1573PCTF44 Pin Plastic 7mm x 7mm Chip-Scale Package (QFN)-55°C to +125°CT3Yes
Downloads
Application Notes
Data Sheets