Quality Application Notes and PCNs

The purpose of this notification is to announce that Holt Integrated Circuits has made a solder ball size change to the HI-2130GBxF Family of Product.

The purpose of this notification is to announce that Holt Integrated Circuits has made a die revision change to the HI-8429 Family of Product and that Product Advisory PA-106 no longer applies.

The purpose of this notification is to announce that Holt Integrated Circuits has updated the Verilog Test Bench and has consequently made a change to the DO-254 Artifacts which are provided with the HI-6300 Product. There was no change to the IP Core.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision to the HI-3210PQTF Product. This is a minor design change to improve device performance by preventing a duplicate FIFO read under specific timing conditions.

The purpose of this notification is to announce the conversion of external leadframe plating finish on certain ARINC, Discrete to Digital & MIL-STD-1553 family of devices from 100% Matte Tin and SnPb plating to Nickel Palladium Gold (NiPdAu) lead finish. In addition, the die attach and mold compound material has changed.

Holt Integrated Circuits is implementing a design change to improve noise immunity for the Power On Reset circuitry, and improve the ESD performance for the RX inputs. This improvement will result in a die revision change for the HI-1585 die from Revision D to Revision F and datasheet DS1584 Revision D to Revision E and DS1585 Revision E to Revision F. The products will be fully compliant to all published specifications of HI-1584 and HI-1585 datasheet.

Holt Integrated Circuits is implementing a minor design change to improve the yield for Tail-Off Compensation over temperature. This improvement will result in a die revision change for the HI-1584 die from Revision F to Revision G. There is no change to Fit, Form, Function, Quality or Reliability of these devices. The products will be fully compliant to all published specifications of HI-1584 and HI-1585 datasheet.

Holt Integrated Circuits is implementing a minor design change to decrease tail-off for digital control and improve the yield for sinusoid no-response at 500mV over temperature. This improvement will result in a die revision change for the HI-1590 die from Revision C to Revision D. There is no change to Fit, Form, Function, Quality or Reliability of these devices. The products will be fully compliant to all published specifications of HI-1590 datasheet.

The purpose of this notification is to announce the addition of NidPdAu Leadframe Finish from Greatek Electronics, Taiwan assembly facility for QFN packages for Holt’s ARINC 429 & MIL-STD-1553 family of devices.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-3585, HI-3586, and HI-3587 Family of Products. This minor design change corrects a potential problem with the HI-3585/6/7, which can transmit an unintended ARINC Label 0x00 message (with all zeros) under certain SPI timing conditions. Information on how this condition occurs and workarounds are provided in Holt’s product advisory PA-102 revision New.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-3585 and HI-3587 Family of Products. The design change improves the robustness of the HI-3585 and HI-3587 ARINC line driver outputs while dynamically transmitting and subjected to transient voltages.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-8588PSxx-10 Product.

The purpose of this notification is to announce the addition of SPEL Semiconductor, India assembly facility for QFN, TSSOP and Small Outline (SOIC) packages for Holt’s ARINC 429, ARINC 825, MIL-STD 1553, and Discrete to Digital family of devices.

The purpose of this notice is to describe an addition to the location of assembly of ceramic packages for the ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.

The purpose of this notice is to document the completed conversion of Holt devices manufactured using the 100mm 4.0um CMOS Wafers at Dalsa Semiconductor in Quebec, Canada to Dalsa’s 150mm 4.0um CMOS Wafers within the same fab.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3585 & HI-3588 Product with regards to SPI Interface Timing at 5.0V and 3.3V.

The purpose of this notification is to announce the addition of Greatek Electronic, Taiwan assembly facility for QFN, TQFP, TSSOP and Small Outline (SOIC) packages for Holt’s ARINC 429, ARINC 825, MIL-STD 1553, Discrete to Digital, & LCD Display Driver family of devices.

The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.

The purpose of this notification is to announce the addition of Millennium Microtech, Thailand assembly facility for Plastic Leaded Chip Carrier (PLCC) and Small Outline (SOIC) packages for Holt’s ARINC 429 and discrete to digital family of devices.

This notice describes the footprint and package changes to the 44 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC family of devices.

This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.

The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the 52 & 44 Lead Quad Flat Pack (QFP) packages to improve the moisture sensitivity level (MSL) for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.

The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the 28 J-Lead PLCC Package for the ARINC 429 family of devices.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3582A, HI-3583A, & HI-3584A Product.

The purpose of this notification is to announce that Holt Integrated Circuits has made a change to the lead standoff for the 20 Pin Plastic Small Outline ESOIC-WB packages assembled at CEI, Thailand.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Datasheet change to the HI-3585 & HI-3588 Product which will result in the elimination of Product Advisory PA-100.

This notice describes the changes to the ARINC 429 Differential Line Driver Die for the HI-3185PSx & HI-3185PSx-N.

100-Lead Quad Flat Pack (QFP) Package Transfer

This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PJx and HI-3183PJx.

This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3188PSx.

This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3182PSx & HI-3183PSx.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

The purpose of this notice is to announce the addition of Criteria Labs in Austin, Texas as a qualified assembly supplier for ceramic side-brazed DIP package for both ARINC 429 and MIL-STD 1553 family of devices.

The purpose of this notice is to announce the completed transfer of the Holt devices manufactured using the 100mm 4.0um CMOS Wafer Process at Dalsa Semiconductor in Quebec, Canada to Dalsa’s 150mm 4.0um CMOS Wafer Process within the same fab.

This notice describes the changes to the ARINC 429 Differential Line Driver Die Change for the HI-3186PSx.

The purpose of this notice is to describe the changes to the ARINC 429 Differential Line Driver Die Change for the 3182PSx-N.

The purpose of this notice is to describe the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.

The purpose of this notice is to describe the changes to the QFN packages for the ARINC 429 and MIL-STD 1553 family of devices.

The purpose of this notice is to describe the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.

The purpose of this notification is to announce that Holt Integrated Circuits has standardized the Die Attach Pad (DAP) size configuration for all products which previously used the 300 mil x 300 mil DAP 44L PLCC Package.

The purpose of this notification is to announce a change to the 44L TQFP (PTQS) package lead formation.

The purpose of this notification is to announce that Holt Integrated Circuits has made a Die Revision Change to the HI-6110 Product which will result in a change to its data sheet.

The purpose of this notification is to announce that Holt Integrated Circuits has standardized the naming and top side marking convention for the 3585 series of ARINC 429 SPI interface products and released the final production version of their respective data sheets.

The purpose of this notice is to describe the changes to the 44-pin plastic QFP packages for the HI-8448PQxx-xx family of ARINC 429 line receiver products.

Holt Integrated Circuits is making a change in Datasheet IDD parameter to account for typical manufacturing variability in it's CMOS High Voltage LCD Display Driver Products.

The purpose of this notification is to document die change to the HI-8585 and HI-8586 ARINC 429 Line Driver products.