HI-22003LBTF

Picture of HI-22003LBTF
Package Description:121 Low Profile Ball Grid Array (BGA)
Temp Range:-55°C to +125°C
Flow:T
RoHS Compliant:Yes
Moisture Sensitivity Level:3
Weight (g):2.098
Theta JA (°C/W):22.5
Theta JB (°C/W):12.1
Product Longevity:> 10 Years
The following quality & reliability information is available for part #HI-22003LBTF
Reliability Monitor Data - Results by Package Type
HTOL Results by Process
TechnologyNumber of Units TestedEquivalent Device Hours at 55°CFailuresFIT(a)MTBF(b)
0.18um CMOS9571.39E+0806.61.51E+08

 Notes:

a. FIT is calculated based on 0.8ev, 60%C.L. and Y1 of 55°C

b. MTBF is calculated as MTBF = 10E+09/FIT Rate.

c. The FIT rate for this process is based on foundry process qualification data and ongoing reliability monitoring.

 

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